The company’s innovations, showcased at the OCP Global Summit, are designed to drive the latest AI-based data centers.

Reframing obsolescence as a natural part of the product lifecycle. Securing supply chains and collaborating for successful product sustainment. Everyone has habits. They permeate every aspect of our ...

Interlink Electronics, Inc. (Nasdaq: LINK) (“Interlink” or the “Company”), a global leader in sensor technology and printed electronic solutions, today announced its participation at the LD Micro Main ...

Elma and TEWS collaborate and share expertise to expand the support available for embedded system integration and ...

“Right now, DoD customers and federal [contractors] often wait 28 weeks or more for a prototype printed circuit board,” says Ramsdell. “They get a batch of 10, and only one or two might work. By the ...

Interlink Electronics, Inc. (Nasdaq: LINK) (the “Company”), a global leader in sensor technology and printed electronic solutions, announced today the conversion (the “Mandatory Conversion”) of all ...

The companies support a wide range of industry open standards, including PCI Express, PCI, CompactPCI Serial, CompactPCI, PMC, and XMC.

Ultralow Power Smart Sensing, Biometric Authentication, Thermal Imaging Sensing, and Tunable Liquid Crystal Optics Driving Innovations in AIoT, Smart Displays, and Diverse Embedded Applications TAINAN ...

The MIPI Alliance, an international organization that develops specifications that standardize wired interfaces for mobile ...

Industrial computing is rapidly evolving, with new demands for platforms that balance performance, energy efficiency, and reliability ...

Samsung Electronics Co. said Wednesday it will unveil a new headset powered by the Android XR platform, enhanced with ...

Veteran-led Kupros has figured out a way to dramatically speed up the prototyping process for 3D-printed electronics. “You don’t invent something just because it sounds cool,” says Kupros co-founder ...