European Vision AI Client Taps 8nm Ultra-Edge SoC Integrating Sensing and Inference. Semifive said on April 28 it has secured a turnkey design contract for an edge-focused 3D inte ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...

Demand for advanced chips at TSMC is tightening amid the AI boom, with its 3nm process becoming increasingly congested as ...

Amid polarized demand for automotive chips, Taiwanese IC design houses are experiencing growth constraints in this sector due to uncertainties, according to industry sources. Some subscribers prefer ...

Taalas and Etched are two AI chip startups aiming to challenge Nvidia’s dominance in the AI hardware market. Etched is using ASIC chips. Taalas is using eASIC chips. They are both putting the logic ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

On Saturday, China’s Ministry of Commerce kicked off an anti-dumping investigation into American analog integrated circuit chips, accusing U.S. companies of selling at unfairly low prices. That same ...

Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...