Samsung announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that ...
After teasing the launch of a new Fire TV device for some time, Amazon has finally announced the Fire TV Cube, which comes integrated with Alexa, the company’s smart virtual assistant. It is ...
'H-Cube' applies advanced silicon interposer technology and hybrid-substrate structure, allowing efficient integration of 6 HBMs, as well as lower cost benefit SEOUL, Korea -- November 11, 2021-- ...
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