Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology Over the years, IBM has accumulated R&D and manufacturing technologies for ...

NBi FlexPack, the US-based manufacturer of flexible packaging, has adopted electron beam (eBeam) coating technology to add ...

Silicon Box is an advanced semiconductor packaging company, specializing in cutting-edge integration technology and manufacturing processes. We offer solutions that enable chiplet architecture, as ...

European tech company Fresh Inset introduces its Vidre+ Complex application in the US, which is designed to extend produce freshness, quality, appearance and nutrient value, without disrupting brands’ ...

Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...

The packaging industry plays a pivotal role in product protection, consumer convenience, and, more recently, in environmental ...

Amazon India has partnered with IIT Roorkee to develop recyclable and compostable packaging made from agricultural waste. The initiative aims to reduce stubble burning, cut dependence on virgin wood ...

CINCINNATI--(BUSINESS WIRE)--ProAmpac, a leader in flexible packaging and material science, announces the launch of ProActive Intelligence Moisture Protect (MP-1000), a patent-pending breakthrough ...

Amkor Technology's advanced packaging leadership and partnership with TSMC are key growth drivers, targeting a $37 per share price within a year. AMKR's expansion in Korea, Vietnam, and a new facility ...

Once packaging leaves the consumer, it enters fragmented collection and sorting systems where contamination, infrastructure ...

Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).