Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the ...

Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, ...

Researchers can now fabricate a 3D chip with alternating layers of semiconducting material grown directly on top of each other. The method eliminates thick silicon substrates between the layers, ...

China is stepping up its chip self-sufficiency push by combining relatively mature chips with new computing architectures in an effort to approach Nvidia's performance levels, according to a top ...

In a few weeks, Intel will release Ivy Bridge, the first mass-produced 22nm parts, and more importantly the first to use 3D "tri-gate" FinFET transistors. These CPUs will be incredibly fast and use ...

Intel has a new 3D technology to allow for 3D chip stacking, despite previous problems with this type of capability. Share on Facebook (opens in a new window) Share on X (opens in a new window) Share ...

TSMC has recently announced SoIC-P, microbump versions of its System on Integrated Chips (SoIC) solutions providing a cost-effective way for 3D chip stacking. TSMC said SoIC-P complements its existing ...

Researchers at the Massachusetts Institute of Technology have developed a technique to create a multilayered chip with alternating layers of high-quality semiconducting material grown directly on top ...