The entire stress-strain curve can now be determined using nanoindentation with a flat-ended cylindrical punch and novel analysis of the resulting force-displacement data 1. Unlike pyramidal indenters ...
Thermal and mechanical stresses are creating significant challenges in heterogeneous chiplet assemblies, increasing the time and cost required to work through all the possible physical effects, ...
This video is an introduction to stress and strain, which are fundamental concepts that are used to describe how an object responds to externally applied loads. Stress is a measure of the distribution ...
Are your environmental test results exposing true device weaknesses, or just reflecting extreme stress conditions?