IP companies have heralded a new age in platform-based design for years – ever since semiconductor integration capacity reached the point where entire systems could theoretically be integrated into a ...

SystemC standards group Open SystemC Initiative (OSCI) has released the SystemC TLM (transaction-level modeling) standard version 1.0. The TLM standard kit, which can be downloaded under an open ...

The Open SystemC Initiative (OSCI) has delivered its Draft SystemC Transaction-Level Modeling (TLM) 2.0 kit, containing proposed extensions to OSCI TLM application programming interface (API) ...

The last several years have seen strong adoption of transaction-level models using SystemC TLM 2.0. Those models are used for software validation and virtual prototyping. For functional verification, ...

PISCATAWAY, N.J.--(BUSINESS WIRE)--IEEE, the world's largest professional association advancing technology for humanity, today announced that the IEEE Standards Association (IEEE-SA) Standards Board ...

THAME, England--(BUSINESS WIRE)--The Open Virtual Platforms (OVP) initiative (www.OVPworld.org) has announced the release of a reference virtual platform of the ARM Integrator development board using ...

First and only industry-ready kit leveraging OSCI 2.0 ensures OCP-IP kit is the most advanced and complete offering available Beaverton ORE. — April 21, 2009 — Open Core Protocol International ...

Transaction-level modeling – an abstracted representation of design IP above the RT level — continues to grow in importance for architectural exploration, performance analysis, building virtual ...

At the 45th Design Automation Conference in June 2008, the Open SystemC Initiative (OSCI) announced the ratification of the TLM-2.0 standard, enabling interoperability for transaction ...

PORTLAND, ORE — April 11, 2006 — Open Core Protocol International Partnership (OCP-IP) today announced the availability of the SystemC Transaction Level Monitor (TLM) Channel version 2.1.2. The ...