Orbital data centers, defense systems, quantum computing, particle physics, and advanced manufacturing are raising the bar ...
Researchers at the UC Berkeley and FuriosaAI published a technical paper titled “Characterizing High Bandwidth Flash for LLM ...
Researchers at Georgia Institute of Technology, Qatar Computing Research Institute, and Purdue University published a ...
Researchers at Infineon Technologies and Technical University of Munich published a technical paper titled “From Physical Devices to RTL Models: Abstraction and Validation in Hardware Engineering.” ...
AI may accelerate semiconductor design, but users still need formal proof, semantic continuity, and auditable workflows to trust automation.
As models evolve faster than silicon cycles, chip architects must balance flexible compute, data movement, and ...
The shift from software-defined to AI-defined vehicles raises questions about whether the hardware can keep up.
A mixture of expert agentic AI systems can focus on their tasks with or without a commanding general, but challenges remain ...
Digital twins and thermal sensors; agentic AI workflows; physical AI needs new silicon; RF design changes.
Researchers at Purdue University and the UCLA published a technical paper titled “Experimental Evidence for the Impact of ...
Larger packages, finer routing, and embedded functions are pushing advanced substrates toward application-specific designs.
Chiplet-based architectures are reshaping how high-performance systems are built, enabling designers to partition functionality across multiple dies in a single package for better scalability, yield, ...
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