Huawei has developed 3D DRAM technology
huaweicentral.com
Huawei has developed 3D DRAM technology
Huawei is ready to produce 3D DRAM technology developed in collaboration with the Institute of Microelectronics of the Chinese Academy of Sciences during the VLSI conference 2022 to display various memory-associated exhibitions. Huawei has released Huawei’s 3D DRAM technology, the CAA configuration transistor 3D DRAM is based on indium ...
May 27, 2022
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To meet the demands of next-generation Dynamic Random Access Memory (DRAM), the road map calls for 3D scaling. From high aspect ratio etching to 3D memory architectures, we make higher-density, more efficient memory possible. Learn more in the video. | Lam Research Corporation
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